What is Ansys Icepak and how does it function? Ansys Icepak is a computational fluid dynamics (CFD) solution that specializes in managing heat in electronics. It accurately predicts heat transfer, temperature, and airflow in various electronic components such as power electronics, IC packages, electronic assemblies/enclosures, and PCBs. It utilizes the Ansys Fluent CFD solver, a leading industry software, to conduct thermal and fluid flow analyses for electronic assemblies, integrated circuits (ICs), PCBs (printed circuit boards), and packages. Ansys Icepak allows users to perform studies on radiation, convection, and conduction conjugate heat transfer, as well as species analysis and laminar and turbulent flow modeling, including convection and radiation. Additionally, it provides embedded Joule heating analysis, enabling simultaneous resolution of electrical and thermal domains. It supports the inclusion of electrical voltage and current excitations, as well as thermal sources and loads. Users also benefit from a basic toolkit that facilitates the setup and execution of parametric runs for training design points using the new LPV ROM (Linear Parameter Varying Reduced-Order Model) functionality with Ansys. Solver initialization, meshing, and MCAD geometry loading are significantly faster, reducing time requirements by a factor of 10 to 100 with the Ansys Icepak solver’s performance enhancements.
